PRODUCTSAutomatic Optical Inspection Machine AVI(Surface) > AVI IC Package Substrate (FBGA, CSP, BOC)

Automatic Optical Inspection Machine(光学検査装置)

AVI IC Package Substrate (FBGA, CSP, BOC)

  • Multi-Inspection by optimized in plating&SR Area
  • Realized high speed both sides isnpection system
  • Full auto-transfer system &NG sorting system.
  • Alarm Function for critical defects.
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Isnpection Area Pattern circuit&SR area
Strip size 80mm × 270mm
Thickness 80um~2mm
Isnpection Method Golden master reference-shape/measurement/ tracking/ dia. etc.

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